Wheel Well Removal - Ar62.20-P-1200-21ME
Model 167
The following operation steps are shown on the left side of the vehicle in model 167.1. In case of damage on the right side of the vehicle, these steps must be performed analogously.
The higher-level service document as well as the safety information in the service document must be observed.
- Expose spot welds on connecting carrier (3) and cut out (areas A).
- Expose inert gas weld on the connecting carrier (3) and cut (area B).
- Heat connecting carrier (3) in cross-hatched areas.
Cross-hatched areas are bonded with adhesive.
- Remove connecting carrier (3).
- Expose spot welds on wheel well (1) and cut off (areas C).
- Mark separating point on the wheel well (1) and disconnect (area D).
Do not cut too deeply.
Otherwise the components below can be damaged and weakened.
Dimensions :
d = approx. 100 mm
- Expose spot welds on wheel well (1) and cut out (area E).
- Heat wheel well (1) in crosshatched areas.
Cross-hatched areas are bonded with adhesive.
- Remove wheel well (1).
- Expose spot welds on the longitudinal member (2) and cut off (areas F).
- Expose spot welds on the longitudinal member (2) and drill out with a diameter of 6.5 mm (areas G).
- Expose spot welds on the longitudinal member in the vehicle interior and drill out with a diameter of 6.5 mm (area H).
- Heat body on crosshatched area.
Cross-hatched area is bonded.
- Heat longitudinal member (2) in the cross-hatched areas.
- Remove longitudinal member (2).
Cross-hatched areas are bonded with adhesive.
- Grind mating surfaces down to bare metal in cross-hatched areas.
Sand down spot weld flanges to bare metal on both sides.
Grind mating surfaces on the inside down to bare metal (areas J).
- Remove grinding dust and drill chips.
- Coat insides of spot weld flanges with zinc dust paint.
Do not coat bonding surfaces with zinc dust paint (areas J, K).
Otherwise adhesion problems may occur.
Observe pretreatment of bonding surfaces.
- Grind mating surfaces down to bare metal in cross-hatched areas.
- Remove grinding dust and drill chips.
Observe pretreatment of bonding surface (area L).