Remove Firewall Half - Ar62.25-P-1110-01LWE
Model 213
Model 238
Model 253
Model 293
The next steps are shown on the left side of the vehicle on model 213 and must performed be in the same way on the right side in the event of damage.
- Expose spot welds on pedal bowl (4) and cut off (area A).
It is necessary to cut out common spot welds of pedal bowl (4), firewall and firewall crossmember through 2 sheet metal thicknesses.
- Heat pedal bowl (4) in crosshatched area.
Cross-hatched area is bonded.
- Remove pedal assembly cup (4).
- Mark separating point on firewall crossmember (5) (area B).
Do not cut too deeply.
Otherwise the components below can be damaged and weakened.
Dimensions:
a = approx. 20 mm
b = approx. 65 mm
- Expose spot welds on the firewall crossmember (5) and cut off (area C).
- Expose spot welds on the firewall crossmember (5) and cut off (area D).
It is necessary to cut out common spot welds of firewall crossmember (5) and firewall through 2 sheet metal thicknesses.
- Heat firewall crossmember (5) in crosshatched areas.
Cross-hatched areas are bonded with adhesive.
- Heat firewall crossmember (5) in crosshatched areas.
Heat crossmember firewall (5) from inside (area D1 ).
Cross-hatched areas are bonded with adhesive.
- Remove firewall crossmember (5).
- Expose spot welds on firewall (3) and drill with Ø 6.5 mm bit (area E).
- Expose spot welds on firewall (3) and cut off (area F).
- Expose spot welds on firewall (3) and drill out with a diameter of 6.5 mm (area G).
- Cut solder points on firewall (3) (areas H).
- Expose spot welds on firewall (3) and cut off (area I and J).
Joint spot welds on the connecting carrier and firewall (3) must be cut through 2 panel thicknesses (area I).
- Heat firewall (3) in crosshatched areas.
Cross-hatched areas are bonded with adhesive.
- Heat firewall (3) in crosshatched area.
Cross-hatched area is bonded.
- Remove firewall (3).
- Grind mating surfaces down to bare metal in cross-hatched areas.
- Grind mating surfaces down to bare metal in cross-hatched areas.
- Remove grinding dust and drill chips.
Observe pretreatment of bonding surfaces.