When Using Accelerator (Hot Processing):

• Temperature (min. 80 +/- 5 °C) of cartridge oven must be checked every morning. Connect temperature sensor to DIS or GT1 (in conjunction with MIB (Measurement Interface Box))
• Heat adhesive for at least 1 hour in cartridge oven to 80 +/- 5 °C
  • Write date and time on adhesive when inserting into cartridge oven
  • Insufficient heating (< 1 hour) results in the formation of bubbles/blisters (gluing/cementing not permitted)
  • Temperature < 80 +/- 5 °C results in the formation of bubbles/blisters (gluing/cementing not permitted)
• Remove cured adhesive prior to further processing.
• Mistake in mixing in event of an interruption in application >1 minute (gluing/cementing not permitted)
  • A test bead of 50...70 mm must be rejected after an interruption in application
• Best before dates of accelerator and adhesive must not be more than 3 months apart
  • Best before date >3 months results in the formation of bubbles/blisters (gluing/cementing not permitted)

Sealed adhesive:

• May only be stored for a maximum of 8 hours once it has been heated up to 80 +/- 5 °C.
• The adhesive will be damaged if this time is exceeded (gluing/cementing not permitted)
• Damaged adhesive must not be used and must be disposed of in compliance with national regulations
• Cartridge may only be heated up once
  • If the lower label is black, this adhesive may only still be used cold without accelerator while adhering to the best before date.

If hot processing is not permitted, this is described in the relevant document.